Connecting Hong Kong procurement governance with mainland manufacturing, assembly and testing facilities to provide standardized hardware QC for integrators and data centers.
Cross-referencing exact OEM part numbers (MPN), batch revisions, tamper seals and barcodes. Full physical inspection of chassis sheet metal, PCB traces, gold edge fingers and CPU socket pins for any sign of oxidation or transit damage.
Verifying CPU stepping revisions, DRAM SPD parameters, multi-channel DIMM rank pairing, NVMe/SAS firmware levels, and motherboard PCIe bifurcation topologies on certified test benches.
Running prolonged continuous burn-in based on project tier. Deploying Linpack/Prime95 compute stress, MemTest86 ECC diagnostics, GPU matrix compute stress, and enterprise storage continuous IOPS cycles while monitoring thermals and power ripple stability.
Components heat-sealed in military-spec ESD shielding bags. Complete server chassis and high-value accelerator cards cushioned with custom high-density EPE foam molding, 5-layer heavy-duty export cartons, desiccant packs, and steel-banded pallets.
Generating formal QA sign-off certificates with detailed hardware serial manifests, stress logs, and engineer sign-offs. Coordinated with Hong Kong trade documentation, export customs clearance, and end-use compliance records.
